JPH0337861B2 - - Google Patents

Info

Publication number
JPH0337861B2
JPH0337861B2 JP535485A JP535485A JPH0337861B2 JP H0337861 B2 JPH0337861 B2 JP H0337861B2 JP 535485 A JP535485 A JP 535485A JP 535485 A JP535485 A JP 535485A JP H0337861 B2 JPH0337861 B2 JP H0337861B2
Authority
JP
Japan
Prior art keywords
glass
case
metal sealing
stem
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP535485A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61164243A (ja
Inventor
Kazunari Ichise
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP60005354A priority Critical patent/JPS61164243A/ja
Publication of JPS61164243A publication Critical patent/JPS61164243A/ja
Publication of JPH0337861B2 publication Critical patent/JPH0337861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP60005354A 1985-01-16 1985-01-16 ハ−メチツクパツケ−ジの構造 Granted JPS61164243A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60005354A JPS61164243A (ja) 1985-01-16 1985-01-16 ハ−メチツクパツケ−ジの構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60005354A JPS61164243A (ja) 1985-01-16 1985-01-16 ハ−メチツクパツケ−ジの構造

Publications (2)

Publication Number Publication Date
JPS61164243A JPS61164243A (ja) 1986-07-24
JPH0337861B2 true JPH0337861B2 (en]) 1991-06-06

Family

ID=11608849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60005354A Granted JPS61164243A (ja) 1985-01-16 1985-01-16 ハ−メチツクパツケ−ジの構造

Country Status (1)

Country Link
JP (1) JPS61164243A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110364487B (zh) * 2019-07-23 2024-11-15 西安伟京电子制造有限公司 一种混合集成电路管壳及防止玻璃绝缘子断裂的方法

Also Published As

Publication number Publication date
JPS61164243A (ja) 1986-07-24

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term